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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | KS74HCTLS4050J |
| Description | BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | KS74HCTLS4050J Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Schmitt Trigger: | NO |
| Sub-Category: | Gates |
| Surface Mount: | NO |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 16 |
| Maximum I (ol): | 8 Amp |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-XDIP-T16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | DIP |
| Propagation Delay At Nominal Supply: | 21 ns |
| Moisture Sensitivity Level (MSL): | 3 |
| Load Capacitance (CL): | 50 pF |
| Logic IC Type: | BUFFER |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP16,.3 |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 5 |
