Samsung - KS88C4632Q

KS88C4632Q by Samsung

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Manufacturer Samsung
Manufacturer's Part Number KS88C4632Q
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: RECTANGULAR;
Datasheet KS88C4632Q Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 30 mA
Terminal Finish: TIN LEAD
No. of Terminals: 64
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-PQFP-G64
Package Shape: RECTANGULAR
ROM Words: 32768
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Moisture Sensitivity Level (MSL): 3
Speed: 12 rpm
RAM Bytes: 528
Bit Size: 8
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP64,.7X.95,40
ROM Programmability: MROM
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/5
CPU Family: SAM87
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