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Manufacturer | Samsung |
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Manufacturer's Part Number | KT3170N |
Description | DTMF SIGNALING CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; |
Datasheet | KT3170N Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 5 V |
Maximum Seated Height: | 5.08 mm |
Sub-Category: | Telecom Signaling Circuits |
Surface Mount: | NO |
Maximum Supply Current: | .009 mA |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 18 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-PDIP-T18 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 75 Cel |
Package Code: | DIP |
Width: | 7.62 mm |
Telecom IC Type: | DTMF SIGNALING CIRCUIT |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -25 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP18,.3 |
Length: | 22.95 mm |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL EXTENDED |
Power Supplies (V): | 5 |