Samsung - M470L6524GL0-CB3

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M470L6524GL0-CB3 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number M470L6524GL0-CB3
Description DDR1 DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Package Shape: RECTANGULAR; Length: 67.6 mm;
Datasheet M470L6524GL0-CB3 Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Organization: 64MX64
Maximum Seated Height: 31.9 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 2.3 V
Surface Mount: NO
No. of Terminals: 200
No. of Words: 67108864 words
Terminal Position: DUAL
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
JESD-30 Code: R-XDMA-N200
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: DIMM
No. of Ports: 1
Memory Density: 4294967296 bit
Self Refresh: YES
Memory IC Type: DDR1 DRAM MODULE
Minimum Operating Temperature: 0 Cel
Memory Width: 64
No. of Functions: 1
Length: 67.6 mm
Maximum Access Time: .6 ns
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: AUTO/SELF REFRESH
Terminal Pitch: .6 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.7 V
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