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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | MB-MJ32G |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; JESD-30 Code: R-XUUC-N; Package Style (Meter): UNCASED CHIP; |
| Datasheet | MB-MJ32G Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Memory Density: | 274877906944 bit |
| Organization: | 32GX8 |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Words: | 34359738368 words |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| No. of Words Code: | 32G |
| JESD-30 Code: | R-XUUC-N |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | DIE |
| Temperature Grade: | OTHER |
