Samsung - MZ-M6E250BW

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MZ-M6E250BW by Samsung

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Manufacturer Samsung
Manufacturer's Part Number MZ-M6E250BW
Description FLASH MODULE; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Type: MLC NAND TYPE; Organization: 250GX8; Package Body Material: UNSPECIFIED;
Datasheet MZ-M6E250BW Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Memory Density: 2147483648000 bit
Organization: 250GX8
Surface Mount: YES
Memory IC Type: FLASH MODULE
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Type: MLC NAND TYPE
No. of Words: 268435456000 words
Terminal Position: UNSPECIFIED
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
No. of Words Code: 250G
JESD-30 Code: R-XXMA-N
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Temperature Grade: COMMERCIAL
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