Samsung - S3C2410AXX-YO

S3C2410AXX-YO by Samsung

Image shown is a representation only.

Manufacturer Samsung
Manufacturer's Part Number S3C2410AXX-YO
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: FBGA; Package Shape: SQUARE;
Datasheet S3C2410AXX-YO Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 266 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
Minimum Operating Temperature: -40 Cel
No. of Terminals: 272
Qualification: Not Qualified
Package Equivalence Code: BGA272,17X17,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B272
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.8/3.3
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products