Samsung - S3C2440AXX-YQ

AM3359ZCZD72 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 26 MHz and has low power mode, making it suitable for applications requiring high-speed processing in compact devices. The package style is grid array, low profile, fine pitch with terminal finish of tin silver copper.

The NXP Semiconductors MCF54454CVR200 microprocessor features a 32-bit address and external data bus width, with integrated cache and low power mode. It operates at a max clock frequency of 66 MHz, suitable for industrial applications requiring high-speed processing in compact form factors. The package style is grid array with terminal pitch of 1 mm, making it ideal for space-constrained designs needing efficient data handling capabilities.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;

ATSAMA5D27C-LD2G-CUR by Microchip: 16-bit, 24MHz clock, 32-word RAM. Ideal for industrial applications requiring low power consumption and high-speed processing. Features integrated cache, 51 DMA channels, and operates b/w -40 to 85°C.

MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

Microprocessors;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;

The NXP Semiconductors P2041NXN7NNC microprocessor features 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for automotive applications, it operates at temperatures ranging from -40 to 105°C with low power mode support.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;

The Texas Instruments AM5728BABCXEA microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 38.4 MHz. Ideal for industrial applications requiring high-speed processing in a compact package with low power mode capability.

MICROPROCESSOR; Technology: CMOS;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 0;

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;

Intel FH8065301487717SR3UT is a 64-bit microprocessor with 1170 terminals, operating at speeds up to 1910 rpm. Suitable for industrial applications, it features integrated cache, CMOS technology, and a rectangular grid array package shape.

MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: BGA425,23X23,32; Peak Reflow Temperature (C): 260; Surface Mount: YES;

MCF5373LCVM240J by Freescale Semiconductor is a 32-bit microprocessor with 196 terminals in a grid array package. Operating at speeds up to 240 rpm, it is ideal for industrial applications requiring high performance and reliability. With power supplies of 1.5V and 3.3V, this CMOS technology-based processor can withstand temperatures ranging from -40°C to 85°C.

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;