Samsung - S3C80G9BXX-AQ

S3C80G9BXX-AQ by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3C80G9BXX-AQ
Description Microcontrollers; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR;
Datasheet S3C80G9BXX-AQ Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: NO
Maximum Supply Current: 11 mA
No. of Terminals: 42
Terminal Position: DUAL
Package Style (Meter): IN-LINE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDIP-T42
Package Shape: RECTANGULAR
ROM Words: 32768
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: SDIP
Speed: 4 rpm
RAM Bytes: 272
Bit Size: 8
Minimum Operating Temperature: -25 Cel
Qualification: Not Qualified
Package Equivalence Code: SDIP42,.6
ROM Programmability: MROM
Terminal Pitch: 1.78 mm
Temperature Grade: OTHER
Power Supplies (V): 2/5
CPU Family: SAM87RC
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