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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | S3C830AXX-QX |
| Description | Microcontrollers; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; |
| Datasheet | S3C830AXX-QX Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Maximum Supply Current: | 15 mA |
| No. of Terminals: | 100 |
| Terminal Position: | QUAD |
| Package Style (Meter): | FLATPACK |
| Technology: | CMOS |
| JESD-30 Code: | R-PQFP-G100 |
| Package Shape: | RECTANGULAR |
| ROM Words: | 49152 |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | QFP |
| Speed: | 4.5 rpm |
| RAM Bytes: | 2064 |
| Bit Size: | 8 |
| Minimum Operating Temperature: | -25 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | QFP100,.7X.9 |
| ROM Programmability: | MROM |
| Terminal Pitch: | .635 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 3.3/5 |
| CPU Family: | SAM88RC |
