Samsung - S3C8469XX-AT

S3C8469XX-AT by Samsung

Image shown is a representation only.

Manufacturer Samsung
Manufacturer's Part Number S3C8469XX-AT
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 64; Package Code: SDIP; Package Shape: RECTANGULAR;
Datasheet S3C8469XX-AT Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: NO
Maximum Supply Current: 30 mA
No. of Terminals: 64
Terminal Position: DUAL
Package Style (Meter): IN-LINE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDIP-T64
Package Shape: RECTANGULAR
ROM Words: 32768
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: SDIP
Speed: 12 rpm
RAM Bytes: 528
Bit Size: 8
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: SDIP64,.75
ROM Programmability: MROM
Terminal Pitch: 1.78 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/5
CPU Family: SAM87
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products