Samsung - S3CB519XXX-QX

S3CB519XXX-QX by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3CB519XXX-QX
Description Microcontrollers; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
Datasheet S3CB519XXX-QX Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 8 mA
No. of Terminals: 100
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-PQFP-G100
Package Shape: RECTANGULAR
ROM Words: 16384
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Speed: 8.2 rpm
RAM Bytes: 3072
Bit Size: 8
Minimum Operating Temperature: -25 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP100,.7X.9
ROM Programmability: MROM
Terminal Pitch: .635 mm
Temperature Grade: OTHER
Power Supplies (V): 2.2/5.5
CPU Family: CALMRISC
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