Samsung - S3CI9E0X01

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S3CI9E0X01 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3CI9E0X01
Description Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 64; Package Code: FBGA; Package Shape: SQUARE;
Datasheet S3CI9E0X01 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 64
Qualification: Not Qualified
Package Equivalence Code: BGA64,10X10,20
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-PBGA-B64
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: FBGA
Terminal Pitch: .5 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 1.8/2.5
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