Samsung - S3F401FXXX-QX8F

S3F401FXXX-QX8F by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3F401FXXX-QX8F
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
Datasheet S3F401FXXX-QX8F Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC
Nominal Supply Voltage: 3.3 V
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 300 mA
No. of Terminals: 100
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-PQFP-G100
Package Shape: RECTANGULAR
ROM Words: 262144
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Speed: 90 rpm
RAM Bytes: 20480
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP100,.7X.9
ROM Programmability: FLASH
Terminal Pitch: .635 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
CPU Family: ARM7
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