Samsung - S3F82HBXXX-TX8B

S3F82HBXXX-TX8B by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3F82HBXXX-TX8B
Description Microcontrollers; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
Datasheet S3F82HBXXX-TX8B Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 9 mA
ADC Channels: YES
No. of Terminals: 100
DMA Channels: NO
Terminal Position: QUAD
Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH
No. of I/O Lines: 83
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PQFP-G100
Maximum Clock Frequency: 12 MHz
Package Shape: SQUARE
ROM Words: 65536
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TFQFP
Width: 14 mm
Speed: 12 rpm
Maximum Supply Voltage: 3.6 V
RAM Bytes: 2634
External Data Bus Width: 8
Bit Size: 8
DAC Channels: NO
Minimum Operating Temperature: -25 Cel
Qualification: Not Qualified
Package Equivalence Code: TQFP100,.63SQ
Length: 14 mm
PWM Channels: YES
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Power Supplies (V): 2.5/3.3
CPU Family: SAM88RC
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