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Manufacturer | Samsung |
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Manufacturer's Part Number | S3F866BXX-PZ |
Description | Microcontrollers; Temperature Grade: OTHER; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; |
Datasheet | S3F866BXX-PZ Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.3 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3 V |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
ADC Channels: | YES |
No. of Terminals: | 44 |
DMA Channels: | NO |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER |
No. of I/O Lines: | 30 |
Address Bus Width: | 0 |
Technology: | CMOS |
Maximum Clock Frequency: | 24 MHz |
Package Shape: | SQUARE |
ROM Words: | 65536 |
Terminal Form: | J BEND |
Maximum Operating Temperature: | 85 Cel |
Package Code: | QCCJ |
Width: | 16.61 mm |
Speed: | 24 rpm |
Maximum Supply Voltage: | 3.6 V |
RAM Bytes: | 1040 |
External Data Bus Width: | 0 |
Bit Size: | 8 |
DAC Channels: | NO |
Minimum Operating Temperature: | -25 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC44(UNSPEC) |
Length: | 16.61 mm |
PWM Channels: | YES |
ROM Programmability: | FLASH |
Terminal Pitch: | .5 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 2.5/3.3 |
CPU Family: | SAM8 |