Samsung - S3F8S24XXX-RM98

S3F8S24XXX-RM98 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3F8S24XXX-RM98
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet S3F8S24XXX-RM98 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 4 mA
No. of Terminals: 24
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G24
Package Shape: RECTANGULAR
ROM Words: 4096
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Speed: 12 rpm
RAM Bytes: 272
Bit Size: 8
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: TSSOP24,.25
ROM Programmability: FLASH
Terminal Pitch: .635 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2/5
CPU Family: SAM8
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