Samsung - S3FN21CXXX-EJBC

S3FN21CXXX-EJBC by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3FN21CXXX-EJBC
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: QFP; Package Shape: SQUARE;
Datasheet S3FN21CXXX-EJBC Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 50 mA
No. of Terminals: 176
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: S-PQFP-G176
Package Shape: SQUARE
ROM Words: 24576
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Speed: 40 rpm
RAM Bytes: 8192
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP176,1.0SQ,20
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2/5
CPU Family: CORTEX-M0
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