Samsung - S3P831B-QX

S3P831B-QX by Samsung

Image shown is a representation only.

Manufacturer Samsung
Manufacturer's Part Number S3P831B-QX
Description Microcontrollers; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
Datasheet S3P831B-QX Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 25 mA
No. of Terminals: 100
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-PQFP-G100
Package Shape: RECTANGULAR
ROM Words: 65536
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Speed: 9 rpm
RAM Bytes: 2576
Bit Size: 8
Minimum Operating Temperature: -25 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP100,.7X.9
ROM Programmability: UVPROM
Terminal Pitch: .635 mm
Temperature Grade: OTHER
Power Supplies (V): 2.5/5
CPU Family: SAM88RC
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products