Samsung - S3P851B-QD

S3P851B-QD by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3P851B-QD
Description Microcontrollers; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;
Datasheet S3P851B-QD Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
RAM Bytes: 1792
Sub-Category: Microcontrollers
Surface Mount: YES
Bit Size: 8
Maximum Supply Current: 3.5 mA
Minimum Operating Temperature: 0 Cel
No. of Terminals: 160
Qualification: Not Qualified
Package Equivalence Code: QFP160,1.2SQ
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: S-PQFP-G160
Package Shape: SQUARE
ROM Words: 65536
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Package Code: QFP
ROM Programmability: UVPROM
Terminal Pitch: .635 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 3.3/5
CPU Family: SAM87RC
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