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Manufacturer | Samsung |
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Manufacturer's Part Number | S3P851B-QD |
Description | Microcontrollers; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE; |
Datasheet | S3P851B-QD Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
RAM Bytes: | 1792 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Bit Size: | 8 |
Maximum Supply Current: | 3.5 mA |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 160 |
Qualification: | Not Qualified |
Package Equivalence Code: | QFP160,1.2SQ |
Terminal Position: | QUAD |
Package Style (Meter): | FLATPACK |
Technology: | CMOS |
JESD-30 Code: | S-PQFP-G160 |
Package Shape: | SQUARE |
ROM Words: | 65536 |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 70 Cel |
Package Code: | QFP |
ROM Programmability: | UVPROM |
Terminal Pitch: | .635 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 3.3/5 |
CPU Family: | SAM87RC |