S524C20D11-RCB0 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	S524C20D11-RCB0
Description	EEPROM; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Organization: 128X8;
Datasheet	S524C20D11-RCB0 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.000005 Amp
Organization:	128X8
Sub-Category:	EEPROMs
Surface Mount:	YES
Maximum Supply Current:	3 mA
No. of Terminals:	8
I2C Control Byte:	1010DDDR
No. of Words:	128 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Write Protection:	HARDWARE
Technology:	CMOS
JESD-30 Code:	R-PDSO-G8
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	70 Cel
Endurance:	1000000 Write/Erase Cycles
Package Code:	TSSOP
Serial Bus Type:	I2C
Memory Density:	1024 bit
Memory IC Type:	EEPROM
Minimum Operating Temperature:	-25 Cel
Memory Width:	8
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP8,.25
No. of Words Code:	128
Minimum Data Retention Time:	100
Parallel or Serial:	SERIAL
Terminal Pitch:	.635 mm
Temperature Grade:	OTHER
Power Supplies (V):	3/5

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