Samtec - GFZ-30-01-G-10-AD

  1. Home
  2. Samtec - GFZ-30-01-G-10-AD
GFZ-30-01-G-10-AD by Samtec

Image shown is a representation only.

Manufacturer Samtec
Manufacturer's Part Number GFZ-30-01-G-10-AD
Description IC SOCKET; Device Type Used On: LGA300; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
Datasheet GFZ-30-01-G-10-AD Datasheet
NAME DESCRIPTION
Contact Finish (Mating): Gold (30) over Nickel (50)
IC Socket Type: IC Socket
Contact Finish (Termination): Gold with Nickel Barrier
Housing Material: Liquid Crystal Polymer (LCP)
Device Type Used On: LGA300
Contact Material: Beryllium Copper
Additional Features: Low Profile
JESD-609 Code: e4
No. of Contacts: 300
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

PT08 by Omron

PT08

Omron

RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8;
8-1393163-3 by TE Connectivity

8-1393163-3

TE Connectivity

IC SOCKET; Housing Material: POLYAMIDE; Termination Type: SOLDER; No. of Contacts: 3; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
08-3518-10T by Aries Electronics

08-3518-10T

Aries Electronics

Aries Electronics 08-3518-10T is a DIP18 IC socket with NYLON46 housing and BRASS contacts. Featuring 8 gold-plated contacts, it has TIN over NICKEL termination. Ideal for chip carrier applications, providing reliable connections in electronic devices.
214-44-318-01-670800 by Mill-max Mfg

214-44-318-01-670800

Mill-max Mfg

214-44-318-01-670800 by Mill-max Mfg is a NYLON46 Chip Carrier IC Socket for DIP18 devices with 18 contacts and MATTE TIN finish. It features RECTANGLE contact configuration, ideal for connecting integrated circuits in electronic applications.
228-7396-55-1902 by 3m Electronic Products Division

228-7396-55-1902

3m Electronic Products Division

228-7396-55-1902 by 3M Electronic Products Division is a POLYETHERSULFONE IC SOCKET for SOIC28 devices. It features 28 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) mating finish and GOLD OVER NICKEL termination. Ideal for chip carrier IC applications requiring reliable connectivity.
XR2A-2471-N by Omron

XR2A-2471-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
RXZE2S111M by Schneider Electric Sa

RXZE2S111M

Schneider Electric Sa

RELAY SOCKET;
P6B-26P by Omron

P6B-26P

Omron

RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6; Additional Features: STANDARDS: CSA; UL;
P7S-14F-END by Omron

P7S-14F-END

Omron

RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 14;
XR3G-3211 by Omron

XR3G-3211

Omron

IC SOCKET; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
832-AG11D-ESL-LF by TE Connectivity

832-AG11D-ESL-LF

TE Connectivity

TE Connectivity's 832-AG11D-ESL-LF is a DIP32 IC socket with 32 contacts, rated at 3A current. Featuring a PCB contact row spacing of 15.24mm and rectangular pattern, it has a housing made of polyethylene/polyester. With a temperature range from -55 to 105 °C, it uses solder termination and has an insulation resistance of 5G ohm.
XR2A-3201-N by Omron

XR2A-3201-N

Omron

IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e4; No. of Contacts: 32; Contact Finish (Mating): NOT SPECIFIED;
326-93-103-41-003000 by Mill-max Mfg

326-93-103-41-003000

Mill-max Mfg

Mill-max Mfg's 326-93-103-41-003000 is a PLASTIC IC SOCKET for SIP3 devices with 3 contacts. Features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
P6B-04P by Omron

P6B-04P

Omron

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 4;
3-1571552-0 by TE Connectivity

3-1571552-0

TE Connectivity

TE Connectivity's 3-1571552-0 is a chip carrier IC socket with 32 contacts and a rectangular PCB contact pattern. It has a body length of 1.6 inches, a body width of 0.7 inches, and a body depth of 0.105 inches. This socket is commonly used on DIP32 devices and can withstand temperatures ranging from -55 to 105°C.
VCF4-1000 by TE Connectivity

VCF4-1000

TE Connectivity

IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; No. of Contacts: 1;
410-93-220-10-001000 by Mill-max Mfg

410-93-220-10-001000

Mill-max Mfg

Mill-max Mfg 410-93-220-10-001000 is a Chip Carrier IC Socket with 20 contacts, staggered pattern, and 2.54mm pitch. It uses beryllium copper contacts for DIP20 devices, rated at 3A current. Ideal for PCBs with straight mounting style and operating temperatures from -55 to 125°C.
342-90-139-00-593000 by Mill-max Mfg

342-90-139-00-593000

Mill-max Mfg

Mill-max Mfg's 342-90-139-00-593000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Ni barrier. Ideal for Chip Carrier IC & Component Sockets applications.
299-93-314-10-001000 by Mill-max Mfg

299-93-314-10-001000

Mill-max Mfg

Mill-max Mfg's 299-93-314-10-001000 is a PLASTIC IC SOCKET for DIP14 devices with 14 contacts. Features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for Chip Carrier IC & Component Sockets applications.
110-93-314-10-001000 by Mill-max Mfg

110-93-314-10-001000

Mill-max Mfg

Mill-max Mfg's 110-93-314-10-001000 is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It has 4 contacts, Tin/Lead finish with Nickel barrier, used on DIP4 devices. Ideal for relay applications due to its rectangular contact configuration.