SDIN5D1-2G-L by Sandisk | Memory ICs

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Manufacturer	Sandisk
Manufacturer's Part Number	SDIN5D1-2G-L
Description	FLASH; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
Datasheet	SDIN5D1-2G-L Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	2GX8
Maximum Seated Height:	1 mm
Programming Voltage (V):	3.3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	153
No. of Words:	2147483648 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	VFBGA
Width:	11.5 mm
Moisture Sensitivity Level (MSL):	3
Memory Density:	17179869184 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-25 Cel
Memory Width:	8
No. of Functions:	1
Type:	MLC NAND TYPE
Length:	13 mm
No. of Words Code:	2G
Nominal Supply Voltage / Vsup (V):	3.3
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	3.6 V

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