Schneider Electric Sa - 8501NR61B

  1. Home
  2. Schneider Electric Sa - 8501NR61B
8501NR61B by Schneider Electric Sa

Image shown is a representation only.

Manufacturer Schneider Electric Sa
Manufacturer's Part Number 8501NR61B
Description RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
Datasheet 8501NR61B Datasheet
NAME DESCRIPTION
IC Socket Type: Relay Socket
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

XR2A-6411-N by Omron

XR2A-6411-N

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4;
114-87-624-41-117101 by Preci-dip Sa

114-87-624-41-117101

Preci-dip Sa

IC SOCKET; Device Type Used On: DIP24; Housing Material: PCT POLYESTER; Contact Material: NOT SPECIFIED; No. of Contacts: 24; Contact Finish (Mating): NOT SPECIFIED;
142-10-314-00-594000 by Mill-max Mfg

142-10-314-00-594000

Mill-max Mfg

142-10-314-00-594000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP14 devices with 14 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
PLCC-032-T-N by Samtec

PLCC-032-T-N

Samtec

Samtec's PLCC-032-T-N is a 32-contact IC socket with Liquid Crystal Polymer housing. Featuring bellowed contact style, it operates b/w -55°C to 105°C. Ideal for PLCC32 devices, it has surface mount termination and measures 0.7" x 0.8" x 0.2".
134-10-328-00-010000 by Mill-max Mfg

134-10-328-00-010000

Mill-max Mfg

134-10-328-00-010000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
P6B-26P by Omron

P6B-26P

Omron

RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6; Additional Features: STANDARDS: CSA; UL;
27E043 by TE Connectivity

27E043

TE Connectivity

IC SOCKET; Housing Material: NYLON; No. of Contacts: 11; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
415-43-236-41-003000 by Mill-max Mfg

415-43-236-41-003000

Mill-max Mfg

The Mill-max Mfg 415-43-236-41-003000 is a POLYETHYLENE chip carrier IC socket with 36 contacts, TIN termination, and RECTANGLE contact configuration. It is designed for use on SIP36 devices, providing reliable connectivity in electronic applications.
28-6554-10 by Aries Electronics

28-6554-10

Aries Electronics

Aries Electronics 28-6554-10 is a DIP28 IC socket with 15.24mm PCB row spacing and bellowed contact style. It has 28 contacts, polyphenylene sulfide housing, and matte tin finish for solder termination. Ideal for applications requiring a 1A current rating at up to 105°C operating temperature.
IC51-0844-401-1 by Yamaichi Electronics

IC51-0844-401-1

Yamaichi Electronics

Yamaichi Electronics IC51-0844-401-1 is a PLCC84 socket with POLYETHERIMIDE housing, BE-CU contacts, and 1000000000 ohm insulation resistance. It operates b/w -55°C to 170°C, making it ideal for high-temp applications in electronics manufacturing. The socket has 84 contacts with AU ON NI finish and dielectric voltage of 700VAC.
XR2D-2801-N by Omron

XR2D-2801-N

Omron

IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
A40-LC-TT by Assmann Wsw Components

A40-LC-TT

Assmann Wsw Components

A40-LC-TT by Assmann Wsw Components is a DIP40 IC socket with 40 phosphor bronze contacts and polybutylene terephthalate housing. Contacts have tin finish (80) for mating and termination. Ideal for chip carrier ICs, this rectangular contact configuration ensures secure connections in electronic applications.
173-10-316-00-001000 by Mill-max Mfg

173-10-316-00-001000

Mill-max Mfg

173-10-316-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP16 devices with 16 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
TTD08 by Taicom

TTD08

Taicom

TTD08 by Taicom is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and PBT housing material. It has a solder termination type, operates b/w -40°C to 105°C, and offers a dielectric voltage of 1000VAC. Ideal for chip carrier applications due to its rectangular contact pattern and 2X4 contact configuration.
D2818-42 by Harwin Plc

D2818-42

Harwin Plc

D2818-42 by Harwin PLC is a Chip Carrier IC Socket with 18 contacts, rated for 1A current. Made of plastic, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for DIP18 devices, this socket features solder termination and round pin contact style.
289-PRS17001-12 by Aries Electronics

289-PRS17001-12

Aries Electronics

Aries Electronics 289-PRS17001-12 is a PGA289 IC socket with 289 contacts, gold over nickel finish. It has a body size of 2.294" x 2.075" x 0.265", suitable for PCBs with rectangular contact pattern and 2.54mm row spacing. Ideal for applications requiring high reliability in extreme temperature environments from -65°C to 125°C.
XR2A-1801-N by Omron

XR2A-1801-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
5-1437539-3 by TE Connectivity

5-1437539-3

TE Connectivity

IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: VERTICAL MOUNT DIP SOCKET; No. of Contacts: 20;
818-22-012-10-001101 by Mill-max Mfg

818-22-012-10-001101

Mill-max Mfg

IC SOCKET; Device Type Used On: DIP12; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 12; Contact Finish (Termination): GOLD OVER NICKEL;
10140369-201LF by Amphenol Communications Solutions

10140369-201LF

Amphenol Communications Solutions

Amphenol's 10140369-201LF is a Chip Carrier IC Socket with 225 contacts, featuring a rectangular contact pattern and surface mount termination. With a PCB contact row spacing of 0.99mm, it is designed for BGA225 devices. This IC socket has a mating contact pitch of 0.039" and is ideal for straight mounting applications.