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Manufacturer | Siemens |
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Manufacturer's Part Number | 6AV2181-8XP00-0AX0 |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP; |
Datasheet | 6AV2181-8XP00-0AX0 Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | UNSPECIFIED |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Surface Mount: | YES |
Minimum Operating Temperature: | 0 Cel |
Terminal Position: | UPPER |
Package Style (Meter): | UNCASED CHIP |
Technology: | CMOS |
JESD-30 Code: | R-XUUC-N |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 50 Cel |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Package Code: | DIE |
Temperature Grade: | COMMERCIAL |