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Manufacturer | Silicon Labs |
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Manufacturer's Part Number | EFR32MG13P733F512IM48-D |
Description | SYSTEM ON CHIP; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N48; |
Datasheet | EFR32MG13P733F512IM48-D Datasheet |
In Stock | 934 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.62 V |
Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | .9 mm |
Surface Mount: | YES |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 48 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | S-XQCC-N48 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 125 Cel |
Package Code: | HVQCCN |
Width: | 7 mm |
Moisture Sensitivity Level (MSL): | 2 |
Peripheral IC Type: | SYSTEM ON CHIP |
Maximum Supply Voltage: | 3.8 V |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | LCC48,.28SQ,20 |
Length: | 7 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |