Image shown is a representation only.
| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | BALF-NRG-02D3 |
| Description | RF AND BASEBAND CIRCUIT; Terminal Form: BALL; No. of Terminals: 4; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | BALF-NRG-02D3 Datasheet |
| In Stock | 43,283 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Maximum Seated Height: | .69 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 4 |
| Package Equivalence Code: | BGA4,2X2,40/16 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 1.385 mm |
| JESD-30 Code: | R-PBGA-B4 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | VBGA |
| Width: | .855 mm |
| Terminal Pitch: | 1 mm |
