STMicroelectronics - BALF-NRG-02D3

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BALF-NRG-02D3 by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number BALF-NRG-02D3
Description RF AND BASEBAND CIRCUIT; Terminal Form: BALL; No. of Terminals: 4; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet BALF-NRG-02D3 Datasheet
In Stock43,283
NAME DESCRIPTION
Other Names: 497-17591-1
497-17591-2
497-17591-6
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Telecom IC Type: RF AND BASEBAND CIRCUIT
Maximum Seated Height: .69 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 4
Package Equivalence Code: BGA4,2X2,40/16
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Length: 1.385 mm
JESD-30 Code: R-PBGA-B4
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Peak Reflow Temperature (C): 260
Package Code: VBGA
Width: .855 mm
Terminal Pitch: 1 mm
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