STMicroelectronics - E-STLC60454

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E-STLC60454 by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number E-STLC60454
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: SQUARE;
Datasheet E-STLC60454 Datasheet
In Stock462
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Telecom IC Type: TELECOM CIRCUIT
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 144
Qualification: Not Qualified
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B144
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Temperature Grade: INDUSTRIAL
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