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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | E-STLC61266 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | E-STLC61266 Datasheet |
| In Stock | 1,944 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 676 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B676 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 3 |
