STMicroelectronics - FLI30336-AC

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FLI30336-AC by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number FLI30336-AC
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: UNSPECIFIED; Terminal Position: BOTTOM;
Datasheet FLI30336-AC Datasheet
In Stock153
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Time At Peak Reflow Temperature (s): 30
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
No. of Terminals: 416
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: X-PBGA-B416
Package Shape: UNSPECIFIED
Terminal Form: BALL
Peak Reflow Temperature (C): 250
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
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