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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | FLI30336-AC |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: UNSPECIFIED; Terminal Position: BOTTOM; |
Datasheet | FLI30336-AC Datasheet |
In Stock | 153 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
No. of Terminals: | 416 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | X-PBGA-B416 |
Package Shape: | UNSPECIFIED |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 250 |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |