STMicroelectronics - HCC4007UBK

HCC4007UBK by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number HCC4007UBK
Description Gates; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: RECTANGULAR;
Datasheet HCC4007UBK Datasheet
In Stock4,512
NAME DESCRIPTION
Package Body Material: CERAMIC
Sub-Category: Gates
Surface Mount: YES
Minimum Operating Temperature: -55 Cel
No. of Terminals: 14
Qualification: Not Qualified
Package Equivalence Code: FL14,.3
Terminal Position: DUAL
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-XDFP-F14
Package Shape: RECTANGULAR
Terminal Form: FLAT
Maximum Operating Temperature: 125 Cel
Package Code: DFP
Terminal Pitch: 1.27 mm
Temperature Grade: MILITARY
Power Supplies (V): 3/18
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Pricing (USD)

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