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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | HCC40105BD |
Description | OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE; |
Datasheet | HCC40105BD Datasheet |
In Stock | 4,203 |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC |
Organization: | 16X4 |
Sub-Category: | FIFOs |
Surface Mount: | NO |
Memory IC Type: | OTHER FIFO |
Minimum Operating Temperature: | -55 Cel |
Memory Width: | 4 |
No. of Terminals: | 16 |
No. of Words: | 16 words |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP16,.3 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
No. of Words Code: | 16 |
JESD-30 Code: | R-XDIP-T16 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 125 Cel |
Package Code: | DIP |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | MILITARY |
Power Supplies (V): | 3/18 |