STMicroelectronics - HCC40105BD

HCC40105BD by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number HCC40105BD
Description OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
Datasheet HCC40105BD Datasheet
In Stock4,203
NAME DESCRIPTION
Package Body Material: CERAMIC
Organization: 16X4
Sub-Category: FIFOs
Surface Mount: NO
Memory IC Type: OTHER FIFO
Minimum Operating Temperature: -55 Cel
Memory Width: 4
No. of Terminals: 16
No. of Words: 16 words
Qualification: Not Qualified
Package Equivalence Code: DIP16,.3
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
No. of Words Code: 16
JESD-30 Code: R-XDIP-T16
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Power Supplies (V): 3/18
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