STMicroelectronics - HCC40208BD

HCC40208BD by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number HCC40208BD
Description Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet HCC40208BD Datasheet
In Stock930
NAME DESCRIPTION
Package Body Material: CERAMIC
Sub-Category: Other Memory ICs
Surface Mount: NO
Minimum Operating Temperature: -55 Cel
No. of Terminals: 24
Qualification: Not Qualified
Package Equivalence Code: DIP24,.6
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-XDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Power Supplies (V): 3/18
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Pricing (USD)

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