STMicroelectronics - HCC4034BDT

HCC4034BDT by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number HCC4034BDT
Description PARALLEL IN PARALLEL OUT; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
Datasheet HCC4034BDT Datasheet
In Stock185
NAME DESCRIPTION
Package Body Material: CERAMIC, GLASS-SEALED
Count Direction: BIDIRECTIONAL
Maximum Seated Height: 2.727 mm
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: NO
No. of Terminals: 24
Total Dose (V): 100k Rad(Si)
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-GDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Width: 15.24 mm
No. of Bits: 8
Logic IC Type: PARALLEL IN PARALLEL OUT
Minimum Operating Temperature: -55 Cel
No. of Functions: 1
Package Equivalence Code: DIP24,.6
Length: 30.17 mm
Family: 4000/14000/40000
Terminal Pitch: 2.54 mm
Maximum Supply Voltage (Vsup): 20 V
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Pricing (USD)

Qty. Unit Price Ext. Price
185 - -

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