STMicroelectronics - HCC4050BDG

HCC4050BDG by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number HCC4050BDG
Description BUFFER; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet HCC4050BDG Datasheet
In Stock4,020
NAME DESCRIPTION
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Maximum Seated Height: 3.83 mm
No. of Inputs: 1
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: NO
No. of Terminals: 16
Total Dose (V): 100k Rad(Si)
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-CDIP-T16
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Width: 7.62 mm
Packing Method: TR
Logic IC Type: BUFFER
Minimum Operating Temperature: -55 Cel
No. of Functions: 6
Length: 20.32 mm
Nominal Supply Voltage / Vsup (V): 5
Additional Features: CMOS-TTL LEVEL TRANSLATOR
Family: 4000/14000/40000
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 20 V
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Pricing (USD)

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