HCC4503BDG by STMicroelectronics | Logic ICs

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	HCC4503BDG
Description	BUFFER; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; No. of Inputs: 1;
Datasheet	HCC4503BDG Datasheet
In Stock	3,984

NAME	DESCRIPTION
Package Body Material:	CERAMIC, GLASS-SEALED
Schmitt Trigger:	NO
Maximum Seated Height:	3.7 mm
No. of Inputs:	1
Minimum Supply Voltage (Vsup):	3 V
Surface Mount:	NO
No. of Terminals:	14
Total Dose (V):	100k Rad(Si)
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	CMOS
JESD-30 Code:	R-GDIP-T14
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	125 Cel
Package Code:	DIP
Width:	7.62 mm
Logic IC Type:	BUFFER
Minimum Operating Temperature:	-55 Cel
No. of Functions:	6
Package Equivalence Code:	DIP14,.3
Length:	19 mm
Family:	4000/14000/40000
Terminal Pitch:	2.54 mm
Maximum Supply Voltage (Vsup):	20 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,984	-	-

RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;

Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;

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OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.

SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;

RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;