STMicroelectronics - HCF4007UBF

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HCF4007UBF by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number HCF4007UBF
Description Gates; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet HCF4007UBF Datasheet
In Stock748
NAME DESCRIPTION
Package Body Material: CERAMIC
Sub-Category: Gates
Surface Mount: NO
Terminal Finish: TIN LEAD
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
No. of Terminals: 14
Qualification: Not Qualified
Package Equivalence Code: DIP14,.3
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-XDIP-T14
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Terminal Pitch: 2.54 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/15
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