STMicroelectronics - L99MM70XP

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L99MM70XP by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number L99MM70XP
Description MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR;
Datasheet L99MM70XP Datasheet
In Stock3,996
NAME DESCRIPTION
Minimum Supply Voltage: 6 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 13.5 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.45 mm
Surface Mount: YES
Terminal Finish: Tin (Sn)
No. of Terminals: 36
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G36
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: HSSOP
Width: 7.5 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 18 V
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Length: 10.3 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
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