M2316HB1 by STMicroelectronics | Memory ICs

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	M2316HB1
Description	MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
Datasheet	M2316HB1 Datasheet
In Stock	1,357

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	2KX8
Sub-Category:	MASK ROMs
Surface Mount:	NO
Maximum Supply Current:	70 mA
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	24
No. of Words:	2048 words
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	MOS
JESD-30 Code:	R-PDIP-T24
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	70 Cel
Package Code:	DIP
Memory Density:	16384 bit
Memory IC Type:	MASK ROM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	8
Qualification:	Not Qualified
Package Equivalence Code:	DIP24,.6
Maximum Access Time:	300 ns
No. of Words Code:	2K
Terminal Pitch:	2.54 mm
Temperature Grade:	COMMERCIAL

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,357	-	-

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N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;