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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | M24SR04-GSG12I/2 |
| Description | MEMORY CIRCUIT; Package Code: DIE; Package Shape: ROUND; Peak Reflow Temperature (C): NOT SPECIFIED; No. of Words: 512 words; Memory Width: 8; |
| Datasheet | M24SR04-GSG12I/2 Datasheet |
| In Stock | 2,719 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Memory Density: | 4096 bit |
| Organization: | 512X8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Words: | 512 words |
| Package Equivalence Code: | WAFER |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| No. of Words Code: | 512 |
| JESD-30 Code: | O-XUUC-N |
| Package Shape: | ROUND |
| Terminal Form: | NO LEAD |
| Operating Mode: | SYNCHRONOUS |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | DIE |
| Maximum Supply Voltage (Vsup): | 5.5 V |
