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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | M30LW128D110ZA1 |
| Description | FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00008 Amp; |
| Datasheet | M30LW128D110ZA1 Datasheet |
| In Stock | 2,058 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Programming Voltage (V): | 3.3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Technology: | CMOS |
| No. of Sectors/Size: | 128 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Package Code: | TBGA |
| Toggle Bit: | NO |
| Memory Width: | 16 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA64,8X8,40 |
| Alternate Memory Width: | 8 |
| Ready or Busy: | YES |
| Terminal Pitch: | 1 mm |
| Maximum Standby Current: | .00008 Amp |
| Organization: | 8MX16 |
| Maximum Seated Height: | 1.2 mm |
| Maximum Supply Current: | 30 mA |
| Command User Interface: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 64 |
| No. of Words: | 8388608 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| JESD-30 Code: | R-PBGA-B64 |
| Maximum Operating Temperature: | 70 Cel |
| Width: | 10 mm |
| Memory Density: | 134217728 bit |
| Sector Size (Words): | 128K |
| Memory IC Type: | FLASH MODULE |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Page Size (words): | 4/8 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Common Flash Interface: | YES |
| Length: | 13 mm |
| Maximum Access Time: | 110 ns |
| No. of Words Code: | 8M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Parallel or Serial: | PARALLEL |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Data Polling: | NO |
| Power Supplies (V): | 3/3.3 |
