Image shown is a representation only.
| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | M3444F1 |
| Description | Other Telecom ICs; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC; |
| Datasheet | M3444F1 Datasheet |
| In Stock | 3,425 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Nominal Supply Voltage: | 5 V |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | NO |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| JESD-609 Code: | e0 |
| No. of Terminals: | 28 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP28,.6 |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | MOS |
| JESD-30 Code: | R-XDIP-T28 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Package Code: | DIP |
| Terminal Pitch: | 2.54 mm |
| Power Supplies (V): | 5 |
