STMicroelectronics - M36L0T8060T1ZAQF

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M36L0T8060T1ZAQF by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number M36L0T8060T1ZAQF
Description MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Technology: HYBRID;
Datasheet M36L0T8060T1ZAQF Datasheet
In Stock3,840
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Mixed Memory Type: FLASH+PSRAM
Sub-Category: Other Memory ICs
Surface Mount: YES
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -25 Cel
No. of Terminals: 88
Qualification: Not Qualified
Package Equivalence Code: BGA88,8X12,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: HYBRID
Maximum Access Time: 85 ns
JESD-30 Code: R-PBGA-B88
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 1.8,3
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