STMicroelectronics - M58BF008B100ZA3

M58BF008B100ZA3 by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number M58BF008B100ZA3
Description FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: BGA; Package Shape: RECTANGULAR; Memory Density: 8388608 bit;
Datasheet M58BF008B100ZA3 Datasheet
In Stock319
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000005 Amp
Organization: 256KX32
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 25 mA
Command User Interface: YES
Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
No. of Terminals: 80
No. of Words: 262144 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B80
No. of Sectors/Size: 32
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Memory Density: 8388608 bit
Sector Size (Words): 8K
Toggle Bit: NO
Memory IC Type: FLASH
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Memory Width: 32
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA80,8X10,40
Maximum Access Time: 100 ns
No. of Words Code: 256K
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Data Polling: NO
Power Supplies (V): 3.3,5
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Pricing (USD)

Qty. Unit Price Ext. Price
319 - -

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