STMicroelectronics - M58BW016FB70T3F

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M58BW016FB70T3F by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number M58BW016FB70T3F
Description FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Technology: CMOS;
Datasheet M58BW016FB70T3F Datasheet
In Stock2,468
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000005 Amp
Organization: 512KX32
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 30 mA
Command User Interface: YES
No. of Terminals: 80
No. of Words: 524288 words
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-PQFP-G80
No. of Sectors/Size: 8,31
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: QFP
Boot Block: BOTTOM
Memory Density: 16777216 bit
Sector Size (Words): 2K,16K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 32
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: QFP80,.7X.9,32
Common Flash Interface: YES
Maximum Access Time: 70 ns
No. of Words Code: 512K
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
Data Polling: NO
Power Supplies (V): 2.5/3.3,3/3.3
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Pricing (USD)

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