STMicroelectronics - M74DW66500B70Z

M74DW66500B70Z by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number M74DW66500B70Z
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 73; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
Datasheet M74DW66500B70Z Datasheet
In Stock1,725
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0015 Amp
Mixed Memory Type: FLASH+SRAM
Sub-Category: Other Memory ICs
Surface Mount: YES
Maximum Supply Current: 30 mA
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -40 Cel
No. of Terminals: 73
Qualification: Not Qualified
Package Equivalence Code: BGA73,10X12,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Maximum Access Time: 70 ns
JESD-30 Code: R-PBGA-B73
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3,3/3.3
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