M93S66-BN3TP by STMicroelectronics | Memory ICs

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	M93S66-BN3TP
Description	EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Serial Bus Type: MICROWIRE;
Datasheet	M93S66-BN3TP Datasheet
In Stock	3,507

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	256X16
Maximum Seated Height:	5.33 mm
Minimum Supply Voltage (Vsup):	4.5 V
Surface Mount:	NO
Terminal Finish:	MATTE TIN
Maximum Write Cycle Time (tWC):	10 ms
No. of Terminals:	8
Maximum Clock Frequency (fCLK):	2 MHz
No. of Words:	256 words
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	CMOS
JESD-30 Code:	R-PDIP-T8
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	125 Cel
Package Code:	DIP
Width:	7.62 mm
Serial Bus Type:	MICROWIRE
Memory Density:	4096 bit
Memory IC Type:	EEPROM
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
No. of Functions:	1
Qualification:	Not Qualified
Length:	9.27 mm
No. of Words Code:	256
Nominal Supply Voltage / Vsup (V):	5
Parallel or Serial:	SERIAL
Terminal Pitch:	2.54 mm
Temperature Grade:	AUTOMOTIVE
Maximum Supply Voltage (Vsup):	5.5 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,507	-	-

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