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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | MK48H74P-55 |
Description | MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 8192 words; |
Datasheet | MK48H74P-55 Datasheet |
In Stock | 4,422 |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC |
Maximum Standby Current: | .125 Amp |
Organization: | 8KX8 |
Sub-Category: | SRAMs |
Surface Mount: | NO |
Maximum Supply Current: | 125 mA |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 28 |
No. of Words: | 8192 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-XDIP-T28 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Memory Density: | 65536 bit |
Memory IC Type: | MEMORY CIRCUIT |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP28,.6 |
Maximum Access Time: | 55 ns |
No. of Words Code: | 8K |
Nominal Supply Voltage / Vsup (V): | 5 |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 5 |