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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | NAND02GW3B2DZA6F |
Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; |
Datasheet | NAND02GW3B2DZA6F Datasheet |
In Stock | 1,151 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00005 Amp |
Organization: | 256MX8 |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Maximum Supply Current: | 30 mA |
Command User Interface: | YES |
No. of Terminals: | 63 |
No. of Words: | 268435456 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B63 |
No. of Sectors/Size: | 2K |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Memory Density: | 2147483648 bit |
Sector Size (Words): | 128K |
Toggle Bit: | NO |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
Page Size (words): | 2K |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA63,10X12,32 |
Maximum Access Time: | 20 ns |
No. of Words Code: | 256M |
Ready or Busy: | YES |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Data Polling: | NO |
Power Supplies (V): | 3/3.3 |