STMicroelectronics - NAND02GW3B2DZA6F

NAND02GW3B2DZA6F by STMicroelectronics

Image shown is a representation only.

Manufacturer STMicroelectronics
Manufacturer's Part Number NAND02GW3B2DZA6F
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
Datasheet NAND02GW3B2DZA6F Datasheet
In Stock1,151
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00005 Amp
Organization: 256MX8
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 30 mA
Command User Interface: YES
No. of Terminals: 63
No. of Words: 268435456 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B63
No. of Sectors/Size: 2K
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Memory Density: 2147483648 bit
Sector Size (Words): 128K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
Page Size (words): 2K
Qualification: Not Qualified
Package Equivalence Code: BGA63,10X12,32
Maximum Access Time: 20 ns
No. of Words Code: 256M
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Data Polling: NO
Power Supplies (V): 3/3.3
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
1,151 - -

Popular Products

Category Top Products