NAND08GW3B2BZB6E by STMicroelectronics | Memory ICs

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	NAND08GW3B2BZB6E
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 12 mm;
Datasheet	NAND08GW3B2BZB6E Datasheet
In Stock	3,490

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	1GX8
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	63
No. of Words:	1073741824 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B63
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	9.5 mm
Memory Density:	8589934592 bit
Memory IC Type:	FLASH
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Qualification:	Not Qualified
Length:	12 mm
Maximum Access Time:	25000 ns
No. of Words Code:	1G
Nominal Supply Voltage / Vsup (V):	3
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,490	-	-

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